PMplast TPA 198 BK

Das Produkt

PMplast TPA 198 BK is a black low pressure moulding
resin, based on established highly functional,
co-polyamide chemistry. It is designed for hot melt
applications.
PMplast TPA 198 BK meets the latest requirements
of electronics, e.g. protection against water, dust and
chemicals.

PMplast TPA 198 BK is lead-free and has no silicone
or PAK’s in its recipe. It fulfils the RoHS directive.
The hot melt features superior performance in thermal
and dielectric properties which are maintained
when subjected to environmental stress.

Main Properties
  • Medium viscous melt behavior
  • Listed in UL 94 V0
  • excellent adhesion to most surfaces
  • good flexibility at low temperatures
  • no curing needed
  • RoHS compliant
Resistance to Harsh Conditions

Electronic components, covered with PMplast TPA
198 BK, provide maximum resistance against contaminants
such as dust and many chemicals. It withstands
corrosive gas atmosphere, weak acids, fuels,
oils, glycols and many other fluids used in automotive
and shipping industry.

The coverage retains excellent adhesion, but remains
flexible to withstand distortion of the part.

Processing

In order to achieve satisfactory wetting and fault-free
adhesion with PMplast TPA 198 BK, it is important
to ensure compatibility with all parts of the used
products. Also the design of the mould is highly
important.
A cleaning process can optimize adhesion (e.g.
plasma treatment or conventional washing of the
parts).

PMcoat AC 110-20 is a flammable liquid; good ventilation is important in all processing areas. In order to achieve satisfactory wetting and fault-free adhesion with PMcoat AC 110-20, it is important to ensure compatibility with applied solder resist, paste and flux. A cleaning process can optimize adhesion (e.g. plasma treatment or conventional washing of the PCB’s).

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