Das Produkt

PMplast TPC 950 BK is a black low pressure moulding
resin, based on established highly functional,
saturated co-polyester chemistry. It is designed for
hot melt applications.
PMplast TPC 950 BK meets the latest requirements
of electronics, e.g. protection against water, dust and
chemicals.

PMplast TPC 950 BK is lead-free and has no silicone
or PAK’s in its recipe. It fulfils the RoHS directive.
The hot melt features superior performance in thermal
and dielectric properties which are maintained
when subjected to environmental stress.

Main Properties
  • Medium viscous melt behavior
  • Listed in UL 94 V2
  • High volume resistivity including humid conditions
  • Resists moisture, water, corrosive gas, chemicals
  • good adhesion to most surfaces
  • no curing needed
  • RoHS compliant
Resistance to Harsh Conditions

Electronic components, covered with PMplast TPC
950 BK, provide maximum resistance against contaminants
such as moisture, dust and many chemicals.
It withstands corrosive gas atmosphere, weak acids,
fuels, oils, glycols and many other fluids used in
automotive and shipping industry.

The coverage retains good adhesion, but remains
flexible to withstand distortion of the PCB.

Processing

PMplast TPC 950 BK is optimized for mass production
with automatic and semi-automatic applications.
It can be used tank melting and extrusion equipment.
It is ready to use, if original closed bags were used.
Are there opened bags, a drying step should be
included (minimum 4h at 60°C) to reduce adsorbed
water content. It is recommended to weld bags
again after use.

In order to achieve satisfactory wetting and fault-free
adhesion with PMplast TPC 950 BK, it is important
to ensure compatibility with all parts of the used products.
Also the design of the mould is important.
A cleaning process can optimize adhesion (e.g.
plasma treatment or conventional washing of the
parts).

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