PMplast TPA 198 BK

The product

PMplast TPA 198 BK is a black low pressure moulding
resin, based on established highly functional,
co-polyamide chemistry. It is designed for hot melt
applications.
PMplast TPA 198 BK meets the latest requirements
of electronics, e.g. protection against water, dust and
chemicals.

PMplast TPA 198 BK is lead-free and has no silicone
or PAH in its recipe. It fulfils the RoHS directive.
The hot melt features superior performance in thermal
and dielectric properties which are maintained
when subjected to environmental stress.

Application
  • Covering of electronics for automotive, marine navigation and Industrial devices
  • Protection of electric wires in connectors and cables with strain relief, flex relief and wall bushing
Main Properties
  • Medium viscous melt behavior
  • Listed in UL 94 V0
  • excellent adhesion to most surfaces
  • good flexibility at low temperatures
  • no curing needed
  • RoHS compliant
Resistance to Harsh Conditions

Electronic components, covered with PMplast TPA 198 BK, provide maximum resistance against contaminants such as dust and many chemicals. It withstands corrosive gas atmosphere, weak acids, fuels, oils, glycols and many other fluids used in automotive and shipping industry.

The coverage retains excellent adhesion, but remains
flexible to withstand distortion of the part.

Processing

In order to achieve satisfactory wetting and fault-free adhesion with PMplast TPA 198 BK, it is important to ensure compatibility with all parts of the used products. Also the design of the mould is highly important.
A cleaning process can optimize adhesion (e.g. plasma treatment or conventional washing of the parts).

PMcoat AC 110-20 is a flammable liquid; good ventilation is important in all processing areas. In order to achieve satisfactory wetting and fault-free adhesion with PMcoat AC 110-20, it is important to ensure compatibility with applied solder resist, paste and flux.
A cleaning process can optimize adhesion (e.g. plasma treatment or conventional washing of the PCB’s).

To the data sheet