PMplast TPA 190 BK

The product

PMplast TPA 190 BK is a black low pressure moul-ding resin, based on established highly functional, co-polyamide chemistry. It is designed for hot melt applications.
PMplast TPA 190 BK meets the latest requirements of electronics, e.g. protection against water, dust and chemicals.

PMplast TPA 190 BK is lead-free and has no silicone or PAH in its recipe. It fulfils the RoHS directive.
The hot melt features superior performance in ther-mal and dielectric properties which are maintained when subjected to environmental stress.

Main Properties
  • Medium viscous melt behavior
  • UL 94 V0
  • good adhesion to most surfaces
  • no curing needed
  • RoHS compliant
Resistance to Harsh Conditions

Electronic components, covered with PMplast TPA 190 BK, provide maximum resistance against conta-minants such as dust and many chemicals. It with-stands corrosive gas atmosphere, weak acids, fuels, oils, glycols and many other fluids used in automo-tive and shipping industry.

The coverage retains good adhesion, but remains flexible to withstand distortion of the part.

Processing

PMplast TPA 190 BK is optimized for mass produc-tion with automatic and semi-automatic applications. It is ready to use, if original closed bags were used. Are there opened bags, a drying step should be included (minimum 4h at 60°C) to reduce adsorbed water content. It is recommended to weld bags again after use.

In order to achieve satisfactory wetting and fault-free adhesion with PMplast TPA 190-BK, it is important to ensure compatibility with all parts of the used pro-ducts. Also the design of the mould is important.

To the data sheet