PROTECTION UNDER EXTREME CONDITIONS
It is amazingly easy to work with thermoplastic materials. During the heating process, the material is liquefied and can be turned into any shape or form under low pressure.
Electronic components can be given protective encapsulation. This simple process also warrants high-speed processing. It takes only a few seconds to fill a mould cavity.
It also only takes a few seconds for the material to cool down completely. The component now has lasting protection. This results in high scalability in terms of production quantity.
Once the thermoplastic material has surrounded the sensitive electronic components, they are reliably protected from moisture, dust, dirt and vibrations. This application is ideal particularly for preventing mechanical impacts.
